3D freeform topography

TopoSpect is a valuable tool for persons performing various manual measurements. Measuring tasks such as interior space, circle, line, or spiral measurements can simply be intuitively parameterized and executed with the aid of a wizard. The results of a measurement can subsequently be visualized as statistical, polar, 2D, and 3D representations. There is also scope for application of various mathematical operations such as decentration, circle corrections, or averaging filters to the measured data.
 

StraDex a

SemDex A31 is a fully automated wafer inspection system for automatic loading, measurement, and sorting of up to 300-mm wafers (with or without frames). It has up to two loading ports. Parameters such as layer thickness, TTV, bow/warp, flatness, and, as of recently, TSV depths and roughness are determined in the measuring chamber. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.

SemDex 101

SemDex 301

SemDex 301 is a semi-automatic wafer inspection system: up to 300-mm wafers (also with frames) are introduced manually for fully automated measurement. Measured parameters are layer thickness, TTV, bow/warp, and flatness; TSV depths and roughness have recently also been added to the list. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.