bow/warp/planarity
SemDex M31-a
The cost-effective manual wafer inspection system SemDex M31 - a permits measurements of local 3D surface topographies, bumps, vias and electronics structures at wafers, flat panels, MEMS and other related objects. At any manually selected position,, the integrated
SemDex A32
Automated Non-Contact Metrology System for 3D Advance Wafer Packaging
SemDex A32 is a fully automated wafer inspection system with 2 load-ports and high throughput (more than 60 wafer / hour) for wafer-cassettes until 300 mm max. A version with one load-port is also available.
WaferSpect
SemDex A31
SemDex A31 is a fully automated wafer inspection system for automatic loading, measurement, and sorting of up to 300-mm wafers (with or without frames). It has up to two loading ports. Parameters such as layer thickness, TTV, bow/warp, flatness, and, as of recently, TSV depths and roughness are determined in the measuring chamber. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.
SemDex 300 Series
SemDex 301
SemDex 301 is a semi-automatic wafer inspection system: up to 300-mm wafers (also with frames) are introduced manually for fully automated measurement. Measured parameters are layer thickness, TTV, bow/warp, and flatness; TSV depths and roughness have recently also been added to the list. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.
