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SemDex M31-a

Submitted by Bea on Mon, 04/26/2010 - 14:35

 

The cost-effective manual wafer inspection system SemDex M31 - a permits measurements of local 3D surface topographies, bumps, vias and electronics structures at wafers, flat panels, MEMS and other related objects. At any manually selected position,, the integrated

SemDex A32

Submitted by Bea on Fri, 01/15/2010 - 18:36

Automated Non-Contact Metrology System for 3D Advance Wafer Packaging

 

SemDex A32 is a fully automated wafer inspection system with 2 load-ports and high throughput (more than 60 wafer / hour) for wafer-cassettes until 300 mm max. A version with one load-port is also available.

WaferSpect

Submitted by Bea on Wed, 11/04/2009 - 15:46
WaferSpect is used mainly in the ISIS SemDex instrument designed for evaluation of wafers. This software can perform a wide variety of different measurement tasks, starting with layer thickness measurements of several intermediate layers, as well as bow/warp and stress test measurements.
In conjunction with a twin-sensor system (top/bottom) in which measurement is performed simultaneously from above and below, all the intermediate layers as well as the total thickness of a wafer can be precisely determined.

StratoSpect

Submitted by Bea on Wed, 11/04/2009 - 15:44
StratoSpect is used for measuring the thickness of films, including intermediate layers. The results of a measurement can subsequently be visualized as statistical, FFT, 2D, and 3D representations; furthermore, it is also possible to apply various mathematical filters. The measuring tasks can easily be parameterized with the aid of a wizard.

Principal features of “StratoSpect” software:
 

StraDex f

Submitted by Bea on Wed, 11/04/2009 - 15:44

StraDex f2

StraDex f2

SemDex A31

Submitted by Bea on Wed, 11/04/2009 - 15:39

SemDex F31

SemDex A31 is a fully automated wafer inspection system for automatic loading, measurement, and sorting of up to 300-mm wafers (with or without frames). It has up to two loading ports. Parameters such as layer thickness, TTV, bow/warp, flatness, and, as of recently, TSV depths and roughness are determined in the measuring chamber. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.

SemDex 300 Series

Submitted by Bea on Wed, 11/04/2009 - 15:29

SemDex 301

SemDex 301

SemDex 301 is a semi-automatic wafer inspection system: up to 300-mm wafers (also with frames) are introduced manually for fully automated measurement. Measured parameters are layer thickness, TTV, bow/warp, and flatness; TSV depths and roughness have recently also been added to the list. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.

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