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SemDex 101

SemDex 101

SemDex 101 with connected laptop for immediate presentation of measurement results

SemDex 101

Semi-automatic Table-top Wafer- /Films -inspection System with Integrated Optical Metrology for a Wide Range of Applications

Metrology:

Wafers:

  • (Substrate) thicknesses with sub-µm accuracy
  • Bow/warp, flatness with µm accuracy
  • Bumps, TSV-3D Metrology in nm range
  • TSV depth with high aspect ratios
  • Roughnesses in sub-nm range
  • Thin layers > 0.2 µm
  • Optical inspection and pattern recognition

Films/ Medical Technology:

  • Coating thickness > 5 µm
  • Thin coatings > 0.2 µm
  • Bowing (Bow/Warp), flatness
  • Object thickness (semiconductors, glass, polymer)

Features:

  • Manual loading, automated measurement
  • Compact table-top instrument with optimised footprint
  • Accepts wafers measuring up to 150 mm (6") and polymer objects measurable
  • Framed and unframed wafers
  • Single-sensor configuration (optional additional sensor)
  • Optional vacuum chucks
  • Integrated vacuum generation for fixing wafers
  • Optionally available with high-resolution HD CMOS camera
  • Air-suspended, warp-resistant measuring table for vibration-free measurement
  • x/y-precision measuring stage with precise stepping motor positioning
  • Calibration body integrated into chuck
  • Available in coated steel housing
  • User-friendly WaferSpect software
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Industries / Applications:

Wafers

Films / Coatings

Medical Technology