SemDex 295
with StraDex f sensor and HD CMOS camera
SemDex 295
Cost-effective table-top inspection system for
measurement of bow/ warp and layer thickness
Metrology:
- Substrate layer thickness with sub-µm accuracy
- Bow / warp, flatness with µm accuracy
- Thin films
Features:
- Easy manual loading
- Fast automatic measurement
- Thickness and bow/ warp measurement in one step
- Compact device with optimum footprint
- High data acquisition through rotational stage
- User-friendly WaferSpect software
Industries / Applications: