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SemDex 295

with StraDex f sensor and HD CMOS camera

SemDex 295

Cost-effective table-top inspection system for

measurement of bow/ warp and layer thickness 

Metrology:

  • Substrate layer thickness with sub-µm accuracy
  • Bow / warp, flatness with µm accuracy
  • Thin films

Features:

  • Easy manual loading
  • Fast automatic measurement
  • Thickness and bow/ warp measurement in one step
  • Compact device with optimum footprint
  • High data acquisition through rotational stage
  • User-friendly WaferSpect software