SemDex 295
Cost-effective table-top inspection system for bow/ warp and thickness measurements
Metrology:
• Substrate layer thicknesses with sub-µm accuracy |
Features:
- Easy manual loading
- Fast automatic measurement
- Thickness and bow/ warp measurement in one step
- Compact device with optimum footprint
- High data acquisition through rotational stage
- User-friendly WaferSpect software
Industries / Applications: