SemDex 300 Series
SemDex 301
SemDex 301 is a semi-automatic wafer inspection system: up to 300-mm wafers (also with frames) are introduced manually for fully automated measurement. Measured parameters are layer thickness, TTV, bow/warp, and flatness; TSV depths and roughness have recently also been added to the list. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.
The overall thickness of a sandwich wafer with internal metallization layer can be determined with the aid of a second StraDex f24 sensor head (from below the wafer).
A StraDex p sensor can also be used instead of the StraDex f24 for profilometry of the upper side of the wafer.
This sensor head can also serve for depth determination of TSVs. The newly developed StraDex a sensor head is used for determining roughness.
The integrated vacuum chuck has numerous drill holes to ensure that the wafer remains undistorted during detection of its underside.
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| SemDex301_eng.pdf | 407.59 KB |