SemDex 301
SemDex 301 for manual loading and automated measurement
SemDex 301
SemDex 301 for manual loading and automated measurement
SemDex 301 Sensoren
Closeup view of SemDex 301 with sensors
SemDex 301 Detail
Detailed view inside SemDex 301
SemDex 301
Semi-automatic Wafer-inspection System with Integrated Optical Metrology for a Wide Range of Applications
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Thin layers > 0.2 µm
- Total layer thickness
- Optical inspection and pattern recognition
Features:
- Manual loading, automated measurement
- Standalone instrument with integrated PC and monitor
- Accepts wafers measuring up to 300 mm (12"), for measurement on both sides
- Framed and unframed wafers
- Single, twin, triple, or quadro sensor configuration
- Optional vacuum chucks, also for measurement of both sides
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution HD CMOS camera
- Air-suspended, warp-resistant measuring table for vibration-free measurement
- x/y-precision measuring stage with precise stepping motor positioning
- Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
- Coated steel housing or stainless steel housing for clean room operation
- SEMI S2- and S8-compliant ergonomics
- User-friendly WaferSpect software
- Optional: SECS/ GEM software package – integrated communication interface between fabrication and device