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SemDex 301

SemDex 301

SemDex 301 for manual loading and automated measurement
SemDex 301
SemDex 301
SemDex 301 for manual loading and automated measurement
SemDex 301
SemDex 301 Sensoren
SemDex 301 Sensoren
Closeup view of SemDex 301 with sensors
SemDex 301 Sensoren
SemDex 301 Detail
SemDex 301 Detail
Detailed view inside SemDex 301
SemDex 301 Detail

SemDex 301

Semi-automatic Wafer Inspection System for a Wide Range of Wafer Applications

 

SemDex 301 is a semi-automatic wafer-inspection system for fully automated non-contact measurement of manually loaded wafers measuring up to 300 mm (12“) (also with frame).
Substrate-layer thickness / TTV or the total thickness of a stacked wafer, bow/ warp and flatness of a wafer can be determined with sub-µm / µm accuracy in a single measuring run. Surface roughness can be determined down to nm level. Furthermore TSV, RST and mini-bump parameters can be retrieved.

The intuitive WaferSpect software serves for measurement planning by means of recipes, execution of the measuring tasks including data processing, and saving / export of the relevant measurement and parameter data.

Benefits:

  • High flexibility: 4”, 6”, 8”, 12” wafer
  • Simultaneous measurements possible in one step
  • Measures both framed and unframed wafers
  • Air-suspended measuring table for vibration-free measurement
  • SEMI S2- and S8-compliant ergonomics
  • User-friendly WaferSpect software