SemDex 301
Semi-automatic Wafer-inspection System with Integrated Optical Metrology for a Wide Range of Applications
Metrology:
Features:
- Manual loading, automated measurement
- Standalone instrument with integrated PC and monitor
- Accepts wafers measuring up to 300 mm (12"), for measurement on both sides
- Framed and unframed wafers
- Single, twin, triple, or quadro sensor configuration
- Optional vacuum chucks, also for measurement of both sides
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution HD CMOS camera
- Air-suspended, warp-resistant measuring table for vibration-free measurement
- x/y-precision measuring stage with precise stepping motor positioning
- Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
- Coated steel housing or stainless steel housing for clean room operation
- SEMI S2- and S8-compliant ergonomics
- User-friendly WaferSpect software
- Optional: SECS/ GEM software package – integrated communication interface between fabrication and device





