SemDex A31/A32
A31 is equipped with one FOUP,
A32 with two FOUPs
SemDex A31/A32
A31 is equipped with one FOUP,
A32 with two FOUPs
SemDex A32
SemDex A32 - 2 FOUPs
SemDex A31/A32
Fully Automatic Wafer-inspection System with Integrated Optical Metrology for a Wide Range of Applications
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Thin layers > 0.2 µm
- Total layer thickness
- Optical inspection and pattern recognition
Features:
- Fully automatic loading, automatic measurement
- Standalone instrument with 1 (A31) or 2 (A32) loading ports (FOUPs, Open Cassettes)
- 300 mm (12"), 200 mm (8") wafers, also combinable
- Aligner for reproducible placement of the wafers to within 0.1 mm
- Throughput: up to 60 wafers/ hour (or even more, depending upon the measurement protocol)
- Manual loading of wafers up to 300 mm (12") is feasible
- Framed and unframed wafers, measurable on both sides
- Single, twin, triple, or quadro sensor configuration
- Optional vacuum chucks, also for measurement of both sides
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution HD CMOS camera
- Air-suspended, warp-resistant measuring table for vibration-free measurement
- x/y-precision measuring stage with precise stepping motor positioning
- Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
- Coated steel housing or stainless steel housing for clean room operation
- SEMI S2- and S8-compliant ergonomics
- User-friendly WaferSpect software
- SECS/ GEM software package – integrated communication interface between fabrication and device