SemDex A31/A32
A31 is equipped with one FOUP,
A32 with two FOUPs
SemDex A31/A32
A31 is equipped with one FOUP,
A32 with two FOUPs
SemDex A32
SemDex A32 - 2 FOUPs
SemDex A21
Automatic loading of 200 mm (8") wafers
SemDex A31/A32
Fully Automatic Wafer-inspection System with Integrated Optical Metrology for a Wide Range of Applications
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Thin layers > 0.2 µm
- Total layer thickness
- Optical inspection and pattern recognition
Features:
- 300 mm (12"), 200 mm (8") wafers, also combinable
- Automatic loading and unloading for high-volumen production in wafer fabs
- Single or dual load ports (FOUPs, Open Cassettes)
- High throughput rate - up to 60 wafers per hour
- Non-destructive measurement
- Multi sensor technology
- Air-suspended measuring table with high precision x/y-positioning stage
- Automatic calibration check of layer thickness, 3D-topography, roughness
- Optionally available with high-resolution HD CMOS camera for spot positioning and pattern recognition
- SECS/ GEM software package – integrated communication interface between fabrication and device