SemDex A32

Automated Non-Contact Metrology System for 3D Advance Wafer Packaging

SemDex A32 is a fully automated wafer inspection system with 2 load-ports and high throughput (more than 60 wafer / hour) for wafer-cassettes until 300 mm max. A version with one load-port is also available.

The evaluation comprises thickness (TTV) measurements of substrats (e.g. after back grinding) and bow / warp in one scan. The integrated StraDex f24, p sensors allow thickness-measurements up to 7 µm (standard) and with the latest technology even up to 2.5 µm. In the twin sensor mode also total thicknesses can be evaluated.

With an additional StraDex a sensor roughness up to nm area can be evaluated optionally.

The integrated StraDex f24, p sensors enable thickness values down to 7 µm (standard) or even 2.5 µm with the newest technology. In twin sensor mode total thickness can be evaluated as well.