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SemDex M21
SemDex M21
Submitted by Bea on Wed, 11/04/2009 - 15:41
3D freeform topography
layer thicknesses
roughness/waviness
semdex
Stand-alone systems
wafers
The low-cost completely manual system permits point-by-point measurement of (substrate) layer thicknesses. Up to 8″ wafers can be measured.
Attachment
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SemDexM21_eng.pdf
665,22 KB
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