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SemDex M31
SemDex M31
Submitted by Bea on Thu, 11/05/2009 - 10:35
3D freeform topography
layer thicknesses
roughness/waviness
semdex
Stand-alone systems
wafers
The low-cost completely manual system permits point-by-point measurement of (substrate) layer thicknesses. Up to 12″ wafers can be measured.
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SemDexM31_eng.pdf
665,16 KB
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