WaferSpect
WaferSpect is used mainly in the ISIS SemDex instrument designed for evaluation of wafers. This software can perform a wide variety of different measurement tasks, starting with layer thickness measurements of several intermediate layers, as well as bow/warp and stress test measurements.
In conjunction with a twin-sensor system (top/bottom) in which measurement is performed simultaneously from above and below, all the intermediate layers as well as the total thickness of a wafer can be precisely determined.
Principal features of “WaferSpect” software:
- Control of the ISIS “SemDex” wafer measuring system
- Measurement of layer thicknesses including intermediate layers
- Measurement of individual points, lines, grids, or user-defined points
- Use of various mathematical filters (mean, median, downsampling, etc.)
- Control of an x/y stage
- Bow/warp and stress test measurements
