SemDex 101 for measurement of Bow / Warp, Stress

Semi-automatic Table-top Wafer Inspection System with Integrated Optical Metrology for a Wide Range of Applications

SemDex 101 was designed for offline applications in quality assurance. This compact table-top instrument is fitted with one sensor head and a motorised xy-positioning stage for non-contact measurement of wafers up to 150 mm (6"). Substrate layer thickness, bow/warp, and flatness of a wafer can be determined with sub-µm accuracy in a single measuring run.

Intuitive WaferSpect software serves for measurement planning by means of protocols, execution of the measuring tasks, saving of the relevant measurement data, and their processing, presentation, and export.