SemDex 101
SemDex 101 for Measurement of Thin Films and Coatings
Semi-automatic Table-top Wafer- /Films -inspection System with Integrated Optical Metrology for a Wide Range of Applications
SemDex 301 is a semi-automatic wafer-inspection system for fully automated non-contact measurement of manually loaded wafers measuring up to 300 mm (12") (also with frame). The integrated StraDex t sensor permits measurement of extremely thin layers of below 1 µm.
Substrate-layer thickness or the total thickness of a stacked wafer, bow/warp and flatness of a wafer can be determined with sub-µm accuracy in a single measuring run on additional incorporation of one or two StraDex f sensors. An integrated chuck accepts wafers (framed and unframed) with diameters of 6", 8", and 12".
Intuitive WaferSpect software serves for measurement planning by means of protocols, execution of the measuring tasks, saving of the relevant measurement data, and their processing, presentation, and export.
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/ warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Thin layers > 0.2 µm
- Optical inspection and pattern recognition
Features:
- Manual loading, automated measurement
- Compact table-top instrument with optimised footprint
- Accepts wafers measuring up to 150 mm (6") and polymer objects measurable
- Framed and unframed wafers
- Single-sensor configuration (optional additional sensor)
- Optional vacuum chucks
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution HD CMOS camera
- Air-suspended, warp-resistant measuring table for vibration-free measurement
- x/y-precision measuring stage with precise stepping motor positioning
- Calibration body integrated into chuck
- Available in coated steel housing
- User-friendly WaferSpect software
