SemDex 101
SemDex 101 with connected laptop for immediate presentation of measurement results
SemDex 101 for Measurement of TSVs/ Bumps
Semi-automatic Table-top Wafer Inspection System with Integrated Optical Metrology for a Wide Range of Applications
SemDex 101 was designed for offline applications in quality assurance. This compact table-top instrument is fitted with a sensor head and a motorised xy-positioning stage for non-contact measurement of wafers of up to 150 mm (6"). Use of a StraDex a sensor permits sub-nm measurement of 1D and 2D roughness, as well as bumps and vias. Substrate-layer thickness, bow/warp, and flatness of a wafer can be determined with sub-µm accuracy in a single scan on additional fitting of a StraDex f sensor.
Intuitive WaferSpect software serves for measurement planning by means of protocols, execution of the measuring tasks, saving of the relevant measurement data, and their processing, presentation, and export.
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/ warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Optical inspection and pattern recognition
Features:
- Easy manual loading, fast automated measurement
- Compact table-top instrument with optimised footprint
- Accepts wafers measuring up to 150 mm (6")
- Framed and unframed wafers
- Optional vacuum chucks
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution CMOS camera
- Air-suspended measuring table for vibration-free measurement
- Calibration body integrated into chuck
- Available in coated steel housing
- User-friendly WaferSpect software
