SemDex 101
SemDex 101 with connected laptop for immediate presentation of measurement results
SemDex 101 for Optical Inspection and Pattern Recognition
Semi-automatic Table-top Wafer Inspection System with Integrated Optical Metrology for a Wide Range of Applications
A high-resolution camera integrated into a SemDex wafer inspection system yields razor-sharp images over a measuring area of about 2 × 2 mm2. This provides the basis for a general optical inspection of wafer objects. Moreover, after a learning phase, pattern-recognition software can be used to extract individual characteristics (e.g. measuring marks) in order to repeatedly generate the same coordinate system for the actual measuring points. The StraDex sensors subsequently perform their specific tasks within a lateral positioning accuracy of just a few µm.
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/ warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Optical inspection and pattern recognition
Features:
- Easy manual loading, fast automated measurement
- Compact table-top instrument with optimised footprint
- Accepts wafers measuring up to 150 mm (6")
- Framed and unframed wafers
- Optional vacuum chucks
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution CMOS camera
- Air-suspended measuring table for vibration-free measurement
- Calibration body integrated into chuck
- Available in coated steel housing
- User-friendly WaferSpect software
