SemDex 295 for Measurement of Bow/ Warp, Stress

Cost-effective table-top inspection system for

measurement of bow/ warp and layer thickness 

The SemDex 295 instrument was designed specifically for offline applications in quality assurance. This compact table-top device is fitted with a sensor and with a motorised rotary table and integrated x-stage for fast non-contact measurement of wafers up to 300 mm (12”). The StraDex f layer thickness sensor permits measurement of substrate layer thickness, bow/warp, and flatness of an object with sub-µm accuracy in a single scan. 
Alternatively, the StraDex t10 thin-layer sensor permits measurement of thin films
of < 10 µm and of coatings on films, wafers, and other components.

Intuitive WaferSpect software facilitates measurement planning by means of pre-programmed protocols, execution of the measuring tasks, saving of the relevant measurement data, and their processing, presentation, and export.