SemDex 301 for Measurement of Substrate Layer Thicknesses and TTV

Semi-automatic Wafer-inspection System with Integrated Optical Metrology for a Wide Range of Applications

SemDex 301 is a semi-automatic wafer-inspection system for fully automated non-contact measurement of manually loaded wafers measuring up to 300 mm (12") (also with frame). Substrate-layer thickness or the total thickness of a stacked wafer, bow/ warp and flatness of a wafer can be determined with sub-µm accuracy in a single measuring run with one or two StraDex f sensors. An integrated chuck accepts wafers (framed and unframed) with diameters of 6", 8", and 12".

Intuitive WaferSpect software serves for measurement planning by means of protocols, execution of the measuring tasks, saving of the relevant measurement data, and their processing, presentation, and export.

Metrology:

(Substrate) thicknesses with sub-µm accuracy
Bow/ warp, flatness with µm accuracy
Bumps, TSV-3D Metrology in nm range
TSV depth with high aspect ratios
Roughnesses in sub-nm range
Thin layers > 0.2 µm
Total layer thickness
Optical inspection and pattern recognition

Features:

Manual loading, automated measurement
Standalone instrument with integrated PC and monitor
Accepts wafers measuring up to 300 mm (12"), for measurement on both sides
Framed and unframed wafers
Single, twin, triple, or quadro sensor configuration
Optional vacuum chucks, also for measurement of both sides
Integrated vacuum generation for fixing wafers
Optionally available with high-resolution HD CMOS camera
Air-suspended, warp-resistant measuring table for vibration-free measurement
x/y-precision measuring stage with precise stepping motor positioning
Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
Coated steel housing or stainless steel housing for clean room operation
SEMI S2- and S8-compliant ergonomics
User-friendly WaferSpect software
Optional: SECS/ GEM software package – integrated communication interface between fabrication and device