SemDex 301
SemDex 301 for Measurement of TSVs/ Bumps
Semi-automatic Wafer-inspection System with Integrated Optical Metrology for a Wide Range of Applications
SemDex 301 is a semi-automatic wafer-inspection system for fully automated non-contact measurement of manually loaded wafers measuring up to 300 mm (12") (also with frame). Use of a StraDex a sensor permits sub-nm measurement of 1D and 2D roughness, as well as bumps and vias.
Substrate layer thickness or the total thickness of a stacked wafer, bow/warp and flatness of a wafer can be determined with sub-µm accuracy in a single measuring run on additional incorporation of one or two StraDex f sensors. An integrated chuck accepts wafers (framed and unframed) with diameters of 6", 8", and 12".
Intuitive WaferSpect software serves for measurement planning by means of protocols, execution of the measuring tasks, saving of the relevant measurement data, and their processing, presentation, and export.
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/ warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Thin layers > 0.2 µm
- Total layer thickness
- Optical inspection and pattern recognition
Features:
- Manual loading, automated measurement
- Standalone instrument with integrated PC and monitor
- Accepts wafers measuring up to 300 mm (12"), for measurement on both sides
- Framed and unframed wafers
- Single, twin, triple, or quadro sensor configuration
- Optional vacuum chucks, also for measurement of both sides
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution HD CMOS camera
- Air-suspended, warp-resistant measuring table for vibration-free measurement
- x/y-precision measuring stage with precise stepping motor positioning
- Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
- Coated steel housing or stainless steel housing for clean room operation
- SEMI S2- and S8-compliant ergonomics
- User-friendly WaferSpect software
- Optional: SECS/ GEM software package – integrated communication interface between fabrication and device
