SemDex A31/A32
SemDex A31/32 for Measurement of Thin Film Thickness
Fully Automatic Wafer-inspection System with Integrated Optical Metrology for a Wide Range of Applications
SemDex A31/A32 is a fully automatic wafer-inspection system with one or two loading ports for wafer cassettes up to a maximum size of 300 mm (12"). The system’s high measuring throughput of up to 60 wafers per hour ensures efficient utilisation. Individual wafers can also be loaded manually via an access port and measured automatically. Evaluation after measurement with one or two StraDex f sensors includes information about the layer thickness of substrates (e.g. after the grinding process) or the total thickness of stacked wafers and bow / warp information obtained in just a single scan.
WaferSpect software serves for measurement planning by means of protocols, execution of the measuring tasks, saving of the relevant measurement data, and their processing, presentation, and export.
Another feature is the possibility of interfacing of SemDex A31/A32 with the fab IT infrastructure via SECS/GEM in compliance with SEMI standards.
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/ warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Thin layers > 0.2 µm
- Total layer thickness
- Optical inspection and pattern recognition
Features:
- Fully automatic loading, automatic measurement
- Standalone instrument with 1 (A31) or 2 (A32) loading ports (FOUPs, Open Cassettes)
- 300 mm (12"), 200 mm (8") wafers, also combinable
- Aligner for reproducible placement of the wafers to within 0.1 mm
- Throughput: up to 60 wafers/ hour (or even more, depending upon the measurement protocol)
- Manual loading of wafers up to 300 mm (12") is feasible
- Framed and unframed wafers, measurable on both sides
- Single, twin, triple, or quadro sensor configuration
- Optional vacuum chucks, also for measurement of both sides
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution HD CMOS camera
- Air-suspended, warp-resistant measuring table for vibration-free measurement
- x/y-precision measuring stage with precise stepping motor positioning
- Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
- Coated steel housing or stainless steel housing for clean room operation
- SEMI S2- and S8-compliant ergonomics
- User-friendly WaferSpect software
- SECS/ GEM software package – integrated communication interface between fabrication and device
