SemDex A31/A32
A31 is equipped with one FOUP,
A32 with two FOUPs
SemDex A31/A32
A31 is equipped with one FOUP,
A32 with two FOUPs
SemDex A32
SemDex A32 - 2 FOUPs
SemDex A31/A32 for Optical Inspection and Pattern Recognition
Fully Automatic Wafer-inspection System with Integrated Optical Metrology for a Wide Range of Applications
A high-resolution camera integrated into a SemDex wafer inspection system yields razor-sharp images over a measuring area of about 2 × 2 mm2. This provides the basis for a general optical inspection of wafer objects. Moreover, after a learning phase, pattern-recognition software can be used to extract individual characteristics (e.g. measuring marks) in order to repeatedly generate the same coordinate system for the actual measuring points. The StraDex sensors subsequently perform their specific tasks within a lateral positioning accuracy of just a few µm.
Metrology:
- (Substrate) thicknesses with sub-µm accuracy
- Bow/ warp, flatness with µm accuracy
- Bumps, TSV-3D Metrology in nm range
- TSV depth with high aspect ratios
- Roughnesses in sub-nm range
- Thin layers > 0.2 µm
- Total layer thickness
- Optical inspection and pattern recognition
Features:
- Fully automatic loading, automatic measurement
- Standalone instrument with 1 (A31) or 2 (A32) loading ports (FOUPs, Open Cassettes)
- 300 mm (12"), 200 mm (8") wafers, also combinable
- Aligner for reproducible placement of the wafers to within 0.1 mm
- Throughput: up to 60 wafers/ hour (or even more, depending upon the measurement protocol)
- Manual loading of wafers up to 300 mm (12") is feasible
- Framed and unframed wafers, measurable on both sides
- Single, twin, triple, or quadro sensor configuration
- Optional vacuum chucks, also for measurement of both sides
- Integrated vacuum generation for fixing wafers
- Optionally available with high-resolution HD CMOS camera
- Air-suspended, warp-resistant measuring table for vibration-free measurement
- x/y-precision measuring stage with precise stepping motor positioning
- Calibration body integrated into chuck (layer thickness, 3D-topography, roughness)
- Coated steel housing or stainless steel housing for clean room operation
- SEMI S2- and S8-compliant ergonomics
- User-friendly WaferSpect software
- SECS/ GEM software package – integrated communication interface between fabrication and device
