Wafers/MEMS
SemDex 300 and SemDex 100 stand-alone systems can be used to measure (substrate) layers or surface topographies of (silicon) wafers, flat panel glasses, MEMS, and other objects from the wafer/glass sector.
Measured parameter such as layer thickness, TTV, bow/warp, planarity, and also TSV depths and roughness can readily be visualized. Measurement of single or multiple layers can be performed with an integrated StraDex f24 sensor head.
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stand-alone systems for Wafers/MEMS |
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Sensor heads for Wafers/MEMS |
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Software for Wafers/MEMS
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